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English
English
產(chǎn)品技術(shù)
PRODUCT TECHNOLOGY
技術(shù)路線
產(chǎn)品服務(wù)
Turnkey Solution
Package Design
Package Design
(Strategic Partnership)
TJS have a strategic partnering relationship with Jiangsu Nepes. We leverages each respective expertise to jointly develop and market technologies for Flipchip turnkey solution.
  • 8“ Gold Bump(including COG/COF)
  • 8“ Solder Bump/WLCSP, Copper Pillar Bump、RDL
  • 12"CopperPillar Bump
  • CP/F & Backend Full Turnkey Service
yuan.douglas@taijisemi.com
0512-62622592